Artist’s rendition of ESMC Dresden fab
DRESDEN, Germany, August 20, 2024— ESMC – a three way partnership between TSMC, Robert Bosch GmbH, Infineon Applied sciences AG and NXP
Semiconductors N.V. – at this time held a groundbreaking ceremony to formally mark the preliminary section of land preparation for its first semiconductor fab in Dresden, Germany.
“Along with our companions, Bosch, Infineon and NXP, we’re constructing our Dresden facility to meet the semiconductor wants of the quickly rising European automotive and industrial sectors,” mentioned TSMC Chairman & CEO C.C. Wei. “With this state-of-the-art manufacturing facility, we’ll deliver TSMC’s superior manufacturing capabilities inside attain of our European prospects and companions, which is able to stimulate financial growth throughout the area and drive technological developments throughout Europe.”
The occasion introduced collectively authorities officers, prospects, suppliers, enterprise companions and academia to have a good time a milestone in establishing what would be the EU’s first-ever FinFET-capable pure-play foundry.
Distinguished company included president of the European Fee Ursula von der Leyen, German Chancellor Olaf Scholz, and Saxony Minister President Michael Kretschmer and Lord Mayor of Dresden, Dirk Hilbert. In an illustration of devoted help, throughout the occasion, President von der Leyen introduced that the European Fee has accepted, underneath EU State help guidelines, a €5 billion German measure to help European Semiconductor Manufacturing Firm (ESMC) within the building and operation of the semiconductor fab.
When totally operational, ESMC is anticipated to have a month-to-month manufacturing capability of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET course of know-how, additional strengthening Europe’s semiconductor manufacturing ecosystem with superior FinFET transistor know-how. Whole investments are anticipated to exceed 10 billion euros consisting of fairness injection, debt borrowing, and robust help from the European Union and German authorities.
The brand new facility is anticipated to generate round 2,000 direct high-tech skilled jobs. Moreover, every direct job created by the challenge is anticipated to stimulate the creation of quite a few oblique jobs all through the EU provide chain, bolstering the area’s economic system.
ESMC will uphold TSMC’s requirements of sustainability and environmental safety. In step with this mission, ESMC and its companions are devoted to developing a inexperienced fab that makes use of each present and cutting-edge methods to optimize conservation. This consists of energy-efficient building, water reclamation, and acquiring LEED certification.
The institution of ESMC exemplifies the energy of TSMC’s Grand Alliance, a cornerstone of innovation throughout the semiconductor business. This alliance has pushed groundbreaking developments, bringing collectively TSMC’s companions for a brand new degree of collaboration. The funding in ESMC signifies not only a deeper dedication to this strategic partnership, but additionally underscores TSMC’s unwavering dedication to nurturing innovation throughout Europe.
Building is anticipated to begin later this 12 months.
“The ESMC wafer fab is to be constructed proper subsequent door to our personal Bosch wafer fab in Dresden. So now we can watch it emerge and develop with our personal eyes. We’re trying ahead to that, simply as we’re to collaborating carefully with our companions TSMC, Infineon, and NXP. Collectively, we’ll take Europe a decisive step ahead in a key business, and make sure that superior chips can be found for industrial enterprises right here,” mentioned Dr. Stefan Hartung, chairman of the board of administration of Robert Bosch GmbH.
“Our joint funding in Dresden as soon as once more highlights the large significance of Silicon Saxony as a magnet for main worldwide semiconductor producers,” mentioned Infineon Applied sciences AG CEO Jochen Hanebeck. “The development of one other semiconductor manufacturing facility in Dresden by ESMC constitutes a significant success for the area. We’re bringing to Europe a very essential semiconductor know-how which is utilized in essentially the most fashionable digital chips. This funding will create extra jobs and can completely strengthen the semiconductor ecosystem in Silicon Saxony, in Germany and in Europe as a complete.”
“As we speak marks a historic milestone for the German and European microelectronics business,” mentioned NXP President and CEO Kurt Sievers. “NXP is proud to be a part of the ESMC three way partnership, which is able to ship progressive semiconductor options and manufacturing capability targeted on Europe’s key markets: the automation and electrification of the automotive and industrial sectors. As we speak’s groundbreaking ceremony in Dresden on TSMC’s first manufacturing facility in Europe is a big and tangible step ahead for European digital sovereignty.”
